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LME49811 High Fidelity 200 Volt Power Amplifier Input Stage with Shutdown
January 4, 2008
LME49811 Audio Power Amplifier Series High Fidelity 200 Volt Power Amplifier Input Stage with Shutdown
General Description
The LME49811 is a high fidelity audio power amplifier input stage designed for demanding consumer and pro-audio applications. Amplifier output power may be scaled by changing the supply voltage and number of output devices. The LME49811 is capable of driving an output stage to deliver in excess of 500 watts single-ended into an 8 ohm load in the presence of 10% high line headroom and 20% supply regulation. The LME49811 includes thermal shut down circuitry that activates when the die temperature exceeds 150C. The LME49811's shutdown function when activated, forces the LME49811 into shutdown state.
Key Specifications
Wide operating voltage range PSRR (f = DC) THD+N (f = 1kHz) Output Drive Current
20V to 100V 115dB (typ) 0.00035% (typ) 9mA
Features

Very high voltage operation Scalable output power Minimum external components External compensation Thermal Shutdown
Applications

Powered subwoofers Pro audio Powered studio monitors Audio video receivers Guitar Amplifiers High voltage industrial applications
Typical Application
30004862
FIGURE 1. Typical Audio Amplifier Application Circuit
Overture(R) is a registered trademark of National Semiconductor Corporation.
(c) 2008 National Semiconductor Corporation
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LME49811
30004862
Typical Audio Amplifier Application Circuit
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LME49811
Connection Diagram
30004860
Top View See Order Number LME49811TB NS = National Logo U = Fabrication plant code Z = Assembly plant code XY = 2 Digit date code TT = Die traceability TB = Package code Pin Description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Pin Name NC SD GND IN+ INComp NC NC NC -VEE NC NC Sink Source +VCC Shutdown Control Device Ground Non-Inverting Input Inverting Input External Compensation Connection No Connect, Pin electrically isolated No Connect, Pin electrically isolated No Connect, Pin electrically isolated Negative Power Supply No Connect, Pin electrically isolated No Connect, Pin electrically isolated Output Sink Output Source Positive Power Supply Description No Connect, Pin electrically isolated
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LME49811
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage |V+| + |V-| Differential Input Voltage Common Mode Input Range Power Dissipation (Note 3) ESD Rating(Note 4) ESD Rating (Note 5) Junction Temperature (TJMAX) (Note 8) Soldering Information 200V +/-6V 0.4 VEE to 0.4 VCC 4W 2kV 200V 150C
T Package (10 seconds) Storage Temperature Thermal Resistance JA JC
260C -40C to +150C 73C/W 4C/W (Notes 1, 2) -40C TA +85C
Operating Ratings
Temperature Range TMIN TA TMAX Supply Voltage |V+| + |V-|
+/-20V VTOTAL +/-100V
Electrical Characteristics +VCC = -VEE = 50V
Symbol Parameter
(Notes 1, 2) The following specifications apply for ISD = 1.5mA, Figure 1, unless otherwise specified. Limits apply for TA = 25C, CC = 30pF. Conditions LME49811 Typical (Note 6) ICC IEE THD+N AV AV VOM VNOISE IOUT ISD SR VOS IB PSRR Total Quiescent Power Supply Current Total Quiescent Power Supply Current Total Harmonic Distortion + Noise Closed Loop Voltage Gain Open Loop Gain Output Voltage Swing Output Noise Output Current Current into Shutdown Pin Slew Rate Input Offset Voltage Input Bias Current Power Supply Rejection Ratio VIN = 1mVRMS, f = 1kHz f = DC THD+N = 0.05%, Freq = 20Hz to 20kHz LPF = 30kHz, Av = 29dB A-weighted Outputs Shorted To put part in "play" mode VIN = 1.2VP-P, f = 10kHz square Wave, Outputs shorted VCM = 0V, IO = 0mA VCM = 0V, IO = 0mA DC, Input Referred 93 120 33 100 70 8 1.5 16 1 100 115 105 180 6.5 1 2 13 3 VCM = 0V, VO = 0V, IO = 0A VCM = 0V, VO = 0V, IO = 0A No load, AV = 29dB VOUT = 20VRMS, f = 1kHz 14 16 0.00055 Limit (Note 7) 17 19 0.0015 26 Units (Limits)
mA (max) mA (max) % (max) dB (min) dB dB VRMS V V (max) mA(min) mA(min) mA (max) V/s (min) mV (max) nA dB (min)
Electrical Characteristics +VCC = -VEE = 100V
Symbol Parameter
(Notes 1, 2) The following specifications apply for ISD = 1.5mA, Figure 1, unless otherwise specified. Limits apply for TA = 25C. Conditions LME49811 Typical (Note 6) Limit (Note 7) 22 24 0.001 26 Units (Limits)
ICC IEE THD+N AV
Total Quiescent Power Supply Current Total Quiescent Power Supply Current Total Harmonic Distortion + Noise Closed Loop Voltage Gain
VCM = 0V, VO = 0V, IO = 0A VCM = 0V, VO = 0V, IO = 0A No load, AV = 30dB VOUT = 30VRMS, f = 1kHz
17 19 0.00035
mA (max) mA (max) % (max) dB (min)
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LME49811
Symbol
Parameter
Conditions
LME49811 Typical (Note 6) Limit (Note 7)
Units (Limits) dB dB VRMS V
AV VOM VNOISE IOUT ISD SR VOS IB PSRR
Open Loop Gain Output Voltage Swing Output Noise Output Current Current into Shutdown Pin Slew Rate Input Offset Voltage Input Bias Current Power Supply Rejection Ratio
VIN = 1mVRMS, f = 1kHz f = DC THD+N = 0.05%, Freq = 20Hz to 20kHz LPF = 30kHz, Av = 29dB A-weighted Outputs Shorted To put part in "play" mode VIN = 1.2VP-P, f = 10kHz square Wave, Outputs shorted VCM = 0V, IO = 0mA VCM = 0V, IO = 0mA f = DC, Input Referred
93 120 68 100 70 9 1.5 17 1 100 115 105 180 7 1 2 14 3
V (max) mA(min) mA(min) mA (max) V/s (min) mV (max) nA (max) dB (min)
Note 1: "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed. Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, JA, and the ambient temperature, TA. The maximum allowable power dissipation is PDMAX = (TJMAX - TA) / JA or the number given in Absolute Maximum Ratings, whichever is lower. Note 4: Human body model, applicable std. JESD22-A114C. Note 5: Machine model, applicable std. JESD22-A115-A. Note 6: Typical values represent most likely parametric norms at TA = +25C, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed. Note 7: Datasheet min/max specification limits are guaranteed by test or statistical analysis. Note 8: The maximum operating junction temperature is 150C. Note 9: The Data taken with Bandwidth = 30kHz, AV = 29dB, CC = 30pF, and TA = 25C except where specified.
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LME49811
Typical Performance Characteristics for LME49811 (Note 9)
THD+N vs Frequency +VCC = -VEE = 100V, VO = 14V THD+N vs Frequency +VCC = -VEE = 100V, VO = 30V
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THD+N vs Frequency +VCC = -VEE = 50V, VO = 10V
THD+N vs Frequency +VCC = -VEE = 50V, VO = 20V
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THD+N vs Frequency +VCC = -VEE = 20V, VO = 5V
THD+N vs Frequency +VCC = -VEE = 20V, VO = 10V
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LME49811
THD+N vs Output Voltage +VCC = -VEE = 50V, f = 20Hz
THD+N vs Output Voltage +VCC = -VEE = 100V, f = 20Hz
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30004882
THD+N vs Output Voltage +VCC = -VEE = 50V, f = 1kHz
THD+N vs Output Voltage +VCC = -VEE = 100V, f = 1kHz
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30004881
THD+N vs Output Voltage +VCC = -VEE = 50V, f = 20kHz
THD+N vs Output Voltage +VCC = -VEE = 100V, f = 20kHz
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30004883
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LME49811
THD+N vs Output Voltage +VCC = -VEE = 20V, f = 20kHz
THD+N vs Output Voltage +VCC = -VEE = 20V, f = 1kHz
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THD+N vs Output Voltage +VCC = -VEE = 20V, f = 20kHz
Closed Loop Frequency Response +VCC = -VEE = 50V, VIN = 1VRMS
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Closed Loop Frequency Response +VCC = -VEE = 100V, VIN = 1VRMS
Output Voltage vs Supply Voltage
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LME49811
PSRR vs Frequency +VCC = -VEE = 100V, No Filters Input Referred, VRIPPLE = 1VRMS on VCC pin
PSRR vs Frequency +VCC = -VEE = 50V, No Filters Input Referred, VRIPPLE = 1VRMS on VCC pin
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PSRR vs Frequency +VCC = -VEE = 100V, No Filters Input Referred, VRIPPLE = 1VRMS on VEE pin
PSRR vs Frequency +VCC = -VEE = 50V, No Filters Input Referred, VRIPPLE = 1VRMS on VEE pin
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Open Loop and Phase Upper-Phase Lower Gain
Supply Current vs Supply Voltage
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LME49811
Test Circuit
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FIGURE 3. Test Circuit
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LME49811
Application Information
SHUTDOWN FUNCTION The shutdown function of the LME49811 is controlled by the amount of current that flows into the shutdown pin. If there is less than 1mA of current flowing into the shutdown pin, the part will be in shutdown. This can be achieved by shorting the shutdown pin to ground or by floating the shutdown pin. If there is between 1mA and 2mA of current flowing into the shutdown pin, the part will be in "play" mode. This can be done by connecting a reference voltage to the shutdown pin through a resistor (RM). The current into the shutdown pin can be determined by the equation ISD = (VREF - 2.9) / RM. For example, if a 5V power supply is connected through a 1.4k resistor to the shutdown pin, then the shutdown current will be 1.5mA, at the center of the specified range. It is also possible to use VCC as the power supply for the shutdown pin, though RM will have to be recalculated accordingly. It is not recommended to flow more than 2mA of current into the shutdown pin because damage to the LME49811 may occur. It is highly recommended to switch between shutdown and "play" modes rapidly. This is accomplished most easily through using a toggle switch that alternatively connects the shutdown pin through a resistor to either ground or the shutdown pin power supply. Slowly increasing the shutdown current may result in undesired voltages on the outputs of the LME49811, which can damage an attached speaker. THERMAL PROTECTION The LME49811 has a thermal protection scheme to prevent long-term thermal stress of the device. When the temperature on the die exceeds 150C, the LME49811 shuts down. It starts operating again when the die temperature drops to about 145C, but if the temperature again begins to rise, shutdown will occur again above 150C. Therefore, the device is allowed to heat up to a relatively high temperature if the fault condition is temporary, but a sustained fault will cause the device to cycle in a Schmitt Trigger fashion between the thermal shutdown temperature limits of 150C and 145C. This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions. Since the die temperature is directly dependent upon the heat sink used, the heat sink should be chosen so that thermal shutdown is not activated during normal operation. Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink section. POWER DISSIPATION AND HEAT SINKING When in "play" mode, the LME49811 draws a constant amount of current, regardless of the input signal amplitude. Consequently, the power dissipation is constant for a given supply voltage and can be computed with the equation PDMAX = ICC* (VCC- VEE). DETERMINING THE CORRECT HEAT SINK The choice of a heat sink for a high-power audio amplifier is made entirely to keep the die temperature at a level such that the thermal protection circuitry is not activated under normal circumstances. The thermal resistance from the die to the outside air, JA (junction to ambient), is a combination of three thermal resistances, JC (junction to case), CS (case to sink), and SA (sink to ambient). The thermal resistance, JC (junction to case), of the LME49811 is 0.4 C/W. Using Thermalloy Thermacote
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thermal compound, the thermal resistance, CS (case to sink), is about 0.2C/W. Since convection heat flow (power dissipation) is analogous to current flow, thermal resistance is analogous to electrical resistance, and temperature drops are analogous to voltage drops, the power dissipation out of the LME49811 is equal to the following: PDMAX = (TJMAX-TAMB) / JA (1)
where TJMAX = 150C, TAMB is the system ambient temperature and JA = JC + CS + SA.
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Once the maximum package power dissipation has been calculated using equation 1, the maximum thermal resistance, SA, (heat sink to ambient) in C/W for a heat sink can be calculated. This calculation is made using equation 2 which is derived by solving for SA in equation 1. SA = [(TJMAX-TAMB)-PDMAX(JC +CS)] / PDMAX (2)
Again it must be noted that the value of SA is dependent upon the system designer's amplifier requirements. If the ambient temperature that the audio amplifier is to be working under is higher than 25C, then the thermal resistance for the heat sink, given all other things are equal, will need to be smaller. PROPER SELECTION OF EXTERNAL COMPONENTS Proper selection of external components is required to meet the design targets of an application. The choice of external component values that will affect gain and low frequency response are discussed below. The gain of each amplifier is set by resistors RF and Ri for the non-inverting configuration shown in Figure 1. The gain is found by Equation 3 below: AV = RF / Ri (V/V) (3)
For best noise performance, lower values of resistors are used. A value of 1k is commonly used for Ri and then setting the value of RF for the desired gain. For the LME49811 the gain should be set no lower than 26dB. Gain settings below 26dB may experience instability. The combination of Ri with Ci (see Figure 1) creates a high pass filter. The low frequency response is determined by these two components. The -3dB point can be found from Equation 4 shown below: fi = 1 / (2RiCi) (Hz) (4)
If an input coupling capacitor is used to block DC from the inputs as shown in Figure 5, there will be another high pass filter created with the combination of CIN and RIN. When using a input coupling capacitor RIN is needed to set the DC bias point on the amplifier's input terminal. The resulting -3dB frequency response due to the combination of CIN and RIN can be found from Equation 5 shown below: fIN = 1 / (2RINCIN) (Hz) (5)
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LME49811
With large values of RIN oscillations may be observed on the outputs when the inputs are left floating. Decreasing the value of RIN or not letting the inputs float will remove the oscillations. If the value of RIN is decreased then the value of CIN will need to increase in order to maintain the same -3dB frequency response. COMPENSATION CAPACITOR The compensation capacitor (CC) is one of the most critical external components in value, placement and type. The capacitor should be placed close to the LME49811 and a silver mica type will give good performance. The value of the capacitor will affect slew rate and stability. The highest slew rate is possible while also maintaining stability through out the power and frequency range of operation results in the best audio performance. The value shown in Figure 1 should be considered a starting value with optimization done on the bench and in listening testing. SUPPLY BYPASSING The LME49811 has excellent power supply rejection and does not require a regulated supply. However, to eliminate possible oscillations all op amps and power op amps should have their supply leads bypassed with low-inductance capacitors having short leads and located close to the package terminals. Inadequate power supply bypassing will manifest itself by a low frequency oscillation known as "motorboating" or by high frequency instabilities. These instabilities can be eliminated through multiple bypassing utilizing a large electrolytic capacitor (10F or larger) which is used to absorb low frequency variations and a small ceramic capacitor (0.1F) to prevent any high frequency feedback through the power supply lines. If adequate bypassing is not provided the current in the supply leads which is a rectified component of the load current may be fed back into internal circuitry. This signal causes low distortion at high frequencies requiring that the supplies be bypassed at the package terminals with an electrolytic capacitor of 470F or more. OUTPUT STAGE USING BIPOLAR TRANSISTORS With a properly designed output stage and supply voltage of 100V, an output power up to 500W can be generated at 0.05% THD+N into an 8 speaker load. With an output current of several amperes, the output transistors need substantial base current drive because power transistors usually have quite low current gain--typical hfe of 50 or so. To increase the current gain, audio amplifiers commonly use Darlington style devices or additional driver stages. Power transistors should be mounted together with the V BE multiplier transistor on the same heat sink to avoid thermal run away. Please see the section Biasing Technique and Avoiding Thermal Runaway for additional information. BIASING TECHNIQUES AND AVOIDING THERMAL RUNAWAY A class AB amplifier has some amount of distortion called Crossover distortion. To effectively minimize the crossover distortion from the output, a VBE multiplier may be used instead of two biasing diodes. A VBE multiplier normally consists of a bipolar transistor (QMULT, see Figure 1) and two resistors (RB1 and RB2, see Figure 1). A trim pot can also be added in series with RB1 for optional bias adjustment. A properly de-
signed output stage, combine with a VBE multiplier, can eliminate the trim pot and virtually eliminate crossover distortion. The VCE voltage of QMULT (also called BIAS of the output stage) can be set by following formula: VBIAS = VBE(1+RB2/RB1) (V) (6)
When using a bipolar output stage with the LME49811 (as in Figure 1), the designer must beware of thermal runaway. Thermal runaway is a result of the temperature dependence of VBE (an inherent property of the transistor). As temperature increases, VBE decreases. In practice, current flowing through a bipolar transistor heats up the transistor, which lowers the VBE. This in turn increases the current gain, and the cycle repeats. If the system is not designed properly this positive feedback mechanism can destroy the bipolar transistors used in the output stage. One of the recommended methods of preventing thermal runaway is to use the same heat sink on the bipolar output stage transistor together with VBE multiplier transistor. When the VBE multiplier transistor is mounted to the same heat sink as the bipolar output stage transistors, it temperature will track that of the output transistors. Its VBE is dependent upon temperature as well, and so it will draw more current as the output transistors heat up, reducing the bias voltage to compensate. This will limit the base current into the output transistors, which counteracts thermal runaway. Another widely popular method of preventing thermal runaway is to use low value emitter degeneration resistors (RE1 and RE2). As current increases, the voltage at the emitter also increases, which decreases the voltage across the base and emitter. This mechanism helps to limit the current and counteracts thermal runaway. LAYOUT CONSIDERATION AND AVOIDING GROUND LOOPS A proper layout is virtually essential for a high performance audio amplifier. It is very important to return the load ground, supply grounds of output transistors, and the low level (feedback and input) grounds to the circuit board common ground point through separate paths. When ground is routed in this fashion, it is called a star ground or a single point ground. It is advisable to keep the supply decoupling capacitors of 0.1F close as possible to LME49811 to reduce the effects of PCB trace resistance and inductance. Following the general rules will optimize the PCB layout and avoid ground loops problems: a) Make use of symmetrical placement of components. b) Make high current traces, such as output path traces, as wide as possible to accommodate output stage current requirement. c) To reduce the PCB trace resistance and inductance, same ground returns paths should be as short as possible. If possible, make the output traces short and equal in length. d) To reduce the PCB trace resistance and inductance, ground returns paths should be as short as possible. e) If possible, star ground or a single point ground should be observed. Advanced planning before starting the PCB can improve audio performance.
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LME49811
Demonstration Board Layout
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Silkscreen Layer
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Top Layer
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LME49811
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Bottom Layer
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LME49811
Revision History
Rev 1.0 1.01 Date 12/19/07 01/04/08 Initial release. Edited the project title (replaced "Driver" with "Power Amplifier Input Stage". Description
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LME49811
Physical Dimensions inches (millimeters) unless otherwise noted
Non-Isolated TO-247 15 Lead Package NS Package Number TB15A
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LME49811
Notes
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LME49811 High Fidelity 200 Volt Power Amplifier Input Stage with Shutdown
Notes
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